Cabot is the innovative expert in deformation processing and property control of tantalum. Our tantalum sputtering products are preferred for the fabrication of sputtering targets for:

• Magnetic storage media
• Inkjet print heads
• Microelectronics devices

Driven by continuous reductions in cost and device size and performance improvements, copper is replacing aluminum for use as interconnects in the latest semiconductors. To prevent copper from migrating through the device and "poisoning" the transistors, a diffusion barrier between the interconnects and the device is necessary. Tantalum and tantalum nitride, produced by sputtering of pure tantalum in the presence of nitrogen, are becoming the established barrier materials for the new copper semiconductors.