Cabot is recognized as the innovative expert in deformation processing and property control of tantalum. Our tantalum sputtering products are preferred for the fabrication of sputtering targets for:

• Magnetic storage media
• Inkjet print heads
• Microelectronics devices, microprocessors and memory chips

 

---

Why is sputtering-grade tantalum by Cabot always your best choice?

---

Quality

• The largest diameter, highest purity tantalum ingots in the world using an electron beam melting process
• Unique process produces the most chemically, metallurgically and mechanically consistent tantalum available
• Uniform microstructure and texture for predictable and consistent sputtering performance over the life of the target

 

Metallurgical Properties

• Microstructure consists of a uniform, equiaxed grain structure, typical grain size 100 microns or less

Texture

• Consistent texture with primary (111)-type global texture

 

---

Typical Sputtering-Grade Tantalum Purity (ppm)

---

Impurities	5N Ta	4N5 Ta	4N Ta	3N5 Ta
FE	<1	<1	<1	<5
Ni	<1	<1	<1	<5
Cr	<1	<1	<1	<5
Cu	<1	<1	<1	<5
Nb	<10	<50	<100	<500
W	<8	<25	<80	<150
Mo	<5	<25	<50	<100
Na	<0.4	<0.4	<1	<5
Li	<0.1	<0.1	<1	<5
K	<0.4	<0.4	<1	<5
U	<0.001	<0.005	<0.005	<0.005
Th	<0.001	<0.005	<0.005	<0.005
Others	<0.1	<1	<5	<10
C	<30	<40	<40
O	<80	<80	<100	<100
N	<30	<40	<40	<50
H	<5	<10	<10	<10

 

Notes:

• For guidance only. Specifications determined with customers.
• Metallic impurities measured by GDMS
• Gaseous impurities measured by LECO