This troubleshooting guide will help you:
- analyze some of the problems encountered in the manufacturing of semicon power cables
- determine the potential causes
- suggest solutions.
Short cable life
| Causes |
Solutions |
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Wrong grade selection
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Bad dispersion
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Low conductivity
| Causes |
Solutions |
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|
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Increase loading of conductive black
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Select XC black designed for the specific cable segment, i.e. for bonded shield or strippable shield.
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Decrease in expected conductivity
| Causes |
Solutions |
|
Excessive break down of the carbon black structure by:
- Excessive shear
- Excessive compounding time
Undispersed conductive black:
- Inconsistent pellet quality due to pellet degradation during transport
- By insufficient shear during compounding
- Wrong grade selection
|
- Optimize compounding conditions by reducing shear, i.e. by increasing temperature, decreasing shear.
- Check conductive black quality during transport. Optimize conveying parameters.
- Increase conductive black loading to increase viscosity.
- Increase shear or length of mixing cycle
- Check resin quality (viscosity).
- Select XC type blacks specified for the specific cable segments.
|
Low quality surface smoothness
| Causes |
Solutions |
- Too low carbon black loading (to attain optimal viscosity for optimal dispersion)
- Wrong grade selection
|
- Adjust conductive black loading to attain the optimal viscosity for dispersion.
- Select conductive black with better surface smoothness performance. XC type black have inherent superior dispersability.
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Poorer surface smoothness than expected
| Causes |
Solutions |
- Undispersed conductive black:
- Inconsistent pellet quality due to excessive degradation in conveying system
- By insufficient shear during compounding
- Poor homogeneity:
- By insufficient distributive mixing)
- Polymer gels (degradation problems)
- Oxidized particles
|
- Check conductive black pellet quality during transport. Optimization of the conveying parameters.
- Adjust conductive carbon black loading f to achieve desired viscosity to attain optimal shear.
- Increase shear or length of mixing cycle
- Check resin quality (viscosity).
- Optimize extrusion conditions, e.g. increase back pressure by using finer screen packs, reduce temperature.
- Use thermally stabilized raw materials
- Ensure machine is clean
- Use anti-oxidants during shut-down period
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Die deposit (die drool)
| Causes |
Solutions |
- Excessive of moisture in raw materials
- Die design and geometry
- Process conditions
- Melt rheology
- Compatibility between raw materials
- Presence of low molecular weight species
- Thermal stability of raw materials
|
- Dry raw materials, store in dry conditions
- Reduce extrusion temperature
- Use highly compatible and thermally stable polymers and additives
- Use processing aids, such as fluoropolymers
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