This troubleshooting guide will help you:

  • analyze some of the problems encountered in the manufacturing of semicon power cables
  • determine the potential causes
  • suggest solutions.

Short cable life

Causes Solutions
  • Wrong grade selection

  • Bad dispersion

  • Choose black that meets XC type black standard

  • Optimize dispersion to get excellent smoothness

 


Low conductivity

Causes Solutions
  • Low conductive black loading

  • Poor dispersion

  • Wrong grade selection or does not meet the XC black standard

  • Increase loading of conductive black

  • Select XC black designed for the specific cable segment, i.e. for bonded shield or strippable shield.

 


Decrease in expected conductivity

Causes Solutions

Excessive break down of the carbon black structure by:

  • Excessive shear
  • Excessive compounding time

Undispersed conductive black:

  • Inconsistent pellet quality due to pellet degradation during transport
  • By insufficient shear during compounding
  • Wrong grade selection
  • Optimize compounding conditions by reducing shear, i.e. by increasing temperature, decreasing shear.
  • Check conductive black quality during transport. Optimize conveying parameters.
  • Increase conductive black loading to increase viscosity.
  • Increase shear or length of mixing cycle
  • Check resin quality (viscosity).
  • Select XC type blacks specified for the specific cable segments.

 


Low quality surface smoothness

Causes Solutions
  • Too low carbon black loading (to attain optimal viscosity for optimal dispersion)
  • Wrong grade selection
  • Adjust conductive black loading to attain the optimal viscosity for dispersion.
  • Select conductive black with better surface smoothness performance. XC type black have inherent superior dispersability.

 


Poorer surface smoothness than expected

Causes Solutions
  • Undispersed conductive black:
  • Inconsistent pellet quality due to excessive degradation in conveying system
  • By insufficient shear during compounding
  • Poor homogeneity:
    • By insufficient distributive mixing)
    • Polymer gels (degradation problems)
    • Oxidized particles
  • Check conductive black pellet quality during transport. Optimization of the conveying parameters.
  • Adjust conductive carbon black loading f to achieve desired viscosity to attain optimal shear.
  • Increase shear or length of mixing cycle
  • Check resin quality (viscosity).
  • Optimize extrusion conditions, e.g. increase back pressure by using finer screen packs, reduce temperature.
  • Use thermally stabilized raw materials
  • Ensure machine is clean
  • Use anti-oxidants during shut-down period

 


Die deposit (die drool)

Causes Solutions
  • Excessive of moisture in raw materials
  • Die design and geometry
  • Process conditions
  • Melt rheology
  • Compatibility between raw materials
  • Presence of low molecular weight species
  • Thermal stability of raw materials
  • Dry raw materials, store in dry conditions
  • Reduce extrusion temperature
  • Use highly compatible and thermally stable polymers and additives
  • Use processing aids, such as fluoropolymers